Twitter Facebook LinkedIn RSS
Welcome to the AUTM Global Technology Portal, where you can easily find the latest university technologies available for licensing worldwide.

Communicate

Thermal Ground Plane For Cooling Chips And Semiconductor Devices

Details

Project TitleThermal Ground Plane For Cooling Chips And Semiconductor Devices
Track Code10350
Websitehttps://techtransfer.universityofcalifornia.edu/NCD/10350.html?utm_source=AUTMGTP&utm_medium=webpage&utm_term=ncdid_10350&utm_campaign=TechWebsites
Short DescriptionResearchers at the University of California, Santa Barbara, have developed a novel Thermal Ground Plane (TGP) for cooling semiconductor devices and integrated circuits that capitalizes on the advantages of titanium as a material as well as wicking action. It consists of an integrated array of micro-scale pillars that serve as a hydrophilic wick array that are placed between titanium sheets. The creation of water vapor within the thermal ground plane causes a variety of wicking actions, as the vapor moves from vapor phase to liquid phase and re-circulates, to cool the chip or other semiconductor device that rests on the thermal ground plane, using similar principles to heat pipes. This TGP has an effective heat conductivity approaching ~20,000 W/mK, roughly 500 times higher than solid Copper.


Abstract


Efficient cooling of semiconductor and integrated circuit devices is critical to their operation. Improvements in cooling allow further technological advancement. Titanium is a unique material suited well for harsh environments and is robust and shock resistant.


 
Tagshardware, Design and Fabrication
 
Posted DateAug 25, 2017 12:03 PM

Advantages

  • The Titanium TGP provides extremely high effective thermal conductivity;
  • Titanium is ductile, light weight and suitable for harsh environments;
  • Suitable for many applications (can be less than 1cm x 1cm or greater than 30cm x 30cm);
  • Fabricated using existing processes such as deep etching, LASER and LCD processing.


Potential Applications

  • Semiconductors/Integrated circuit cooling apparatus




This technology is available for licensing. Patent pending.

Additional Information

Contact Information

Name : University of California, Santa Barbara Office of Technology & Industry Alliances

Title :

Department :

Email : dobis@tia.ucsb.edu

Phone : 805-893-2073

Address :

Principal Investigator

Name : Payam Bozorgi

Department :



Name : Changsong Ding

Department :



Name : Noel MacDonald

Department :



Name : Carl Meinhart

Department :



Name : Brian Piorek

Department :



Name : Gaurav Soni

Department :

Intellectual Property

Patent Number : 8807203

Patent Title :

Patent Application Date :

Patent Publication Date :

Patent Issue Date : Aug 19, 2014

Patent Link : http://www.google.com/patents/US8807203



Patent Number : 20140332187

Patent Title :

Patent Application Date :

Patent Publication Date :

Patent Issue Date : Nov 13, 2014

Patent Link : http://www.google.com/patents/US20140332187