Organization: University of Pittsburgh
One of the top three in the world, the Radio Frequency Identification (RFID) Center of Excellence at the University has a long history of developing novel RF-based technologies, including medical devices. Six companies have been spun out of the RFID Center, some of which have won national innovation development honors, including Best of Show in Emerging Technologies at the Consumer Electronics Show in Las Vegas (2007), the Gold Award in Sensor Components at the Best of Sensors Show (2009), and finalist for the Best of Show at RFID Journal ...
Radiation Tolerant Back Biased CMOS VLSI
Organization: STC UNM
The present invention is a CMOS circuit formed in a semiconductor substrate having improved immunity to total ionizing dose radiation, improved immunity to radiation induced latch up, and improved immunity to a single event upset. The architecture of the present invention can be utilized with the n-well, p-well, or dual-well processes.
A Method and Apparatus for Modulator Based Optical Interconnections - UD09-28 filed with this case
Organization: University of Delaware
Cell Voltage Monitoring System
Organization: University of Delaware
Power Converter and Power Combiner for Power-Limited Power Sources
Organization: University of Delaware
Organization: University of Delaware
Improved Circuit Design Methodology
Organization: University of Alberta
Researchers at the University of Alberta have developed a novel circuit similarity-based placement engine to facilitate the circuit design process. The engine takes advantage of a novel and efficient circuit similarity detection methodology to quantitatively compute similarities among circuits. As such, the essential information in the previous circuit designs can be reused to guide the new design, thus saving engineering effort andreducing the time to market. The placement engine can be seamlessly integrated into many CAD applications to ...
Double-Walled Carbon Nanotubes as Conducting Wires in Household Circuits
Organization: Rice University
Circuit and method for dynamically modifiable signal processor
Organization: Columbia Tech Ventures
Low latency FIFO circuits for mixed asynchronous and synchronous systems
Organization: Columbia Tech Ventures
Variable-length, high-speed asynchronous decoder circuit
Organization: Columbia Tech Ventures
CMOS Negative Resistance/Q Enhancement Method and Apparatus
Organization: Columbia Tech Ventures
Organization: Columbia Tech Ventures
Method and Circuit for Remote Teleinteraction
Organization: University of Michigan
Background The ability to effectively teleconference between multiple sites has become a more important aspect of business as the cost of travel has increased. The coordinated use of local/remote pointer functions and local/remote viewpoint control functions in a telecommunications circuit is termed teleinteraction. Technology This invention expands the techniques and technology of teleconferencing through the innovative use of a teleinteraction circuit layout. These concepts of end-to-end pointing, and end-to-end viewpoint control are ...
Edge-Triggered Flip-flop Circuit Topologies Using NDR Diodes and FETs
Organization: University of Michigan
Background Flip-flop circuits are essential in any digital system design and are used in almost all integrated circuits. Flip-flop circuits are normally used to store data that is a result of a computation performed by a digital circuit or to sequence data in an integrated circuit to facilitate computation. One important characteristic of edge-triggered flip-flop circuits is that data presented at the input of the circuit or as determined by the flip-flop control signals is reflected at the output of the circuit either on low-to-high or ...
Method and Apparatus to Reduce Noise Fluctuations in On-Chip Power Distribution Networks
Organization: Indiana Univ-Purdue University Indianapolis
The invention offers a circuit design technique for reducing the noise fluctuations in on-chip power distribution networks. This noise often results when digital circuits are switched, producing current peaks which cause voltage fluctuations in power supply lines due to the inductive behavior of on-chip or chip-to-package interconnects. Previous attempts to reduce this noise which is becoming increasing a limiting factor in high speed, very deep submicrometer circuit designs, have focused on ground bounce, by lowering the inductance in the ...
Injection-Locked Frequency Dividers with Odd-Number Division Ratios
Organization: Indiana Univ-Purdue University Indianapolis
Frequency dividers are essential building blocks in wireless and wireline communication systems and in radar, where they are used for frequency synthesis, MUX/DEMUX and bandwidth compression. One particular application of a frequency divider is to generate accurate multi-phase signals. Such signals are required for quadrature modulation and quadrature down-conversion and Weaver image rejection. This technology applies to high frequency applications in the microwave and millimeter wave ranges. An injection-locked frequency divider (ILFD) can ...
Low Swing Dual Threshold Voltage Domino Logic Circuits
Organization: Indiana Univ-Purdue University Indianapolis
The invention offers a domino logic circuit for microprocessors with lower power consumption than current designs without sacrificing noise immunity. It employs sleep switch transistors and a dual threshold voltage transistor distribution for placing a domino logic circuit into a low leakage state. Current aggressive circuit design which focus solely on enhancing circuit speed in microprocessors, consume power levels that impose a limiting factor on system performance and functionality. Attempts to reduce power consumption by lowering the ...
Domino Logic with Variable Threshold Voltage Keeper
Organization: Indiana Univ-Purdue University Indianapolis
The invention offers a high speed, low power domino logic circuit for microprocessors. The design involves a dynamic body biased keeper circuit which simultaneously reduces power consumption and speed enhancement. Domino CMOS logic circuits which are commonly used in high performance microprocessors for their high speed and area characteristics, are highly sensitive to noise as compared to static gates. In standard domino logic gates, a feedback keeper is employed to maintain the state of the dynamic node against coupling noise, charge ...
Organization: Indiana Univ-Purdue University Indianapolis
The invention relates to high speed CMOS buffer circuits for transmitting data signals from the input to the output of a buffer, and particularly to high speed CMOS buffer circuits capable of driving large capacitive loads, restoring slow transitioning digital signals, or driving highly resistive RC interconnects lines. The CMOS buffer circuits of the invention are especially useful in digital integrated circuits. CMOS technology is conventionally used to implement digital integrated circuits. Often CMOS circuits drive large capacitive ...
A High Precision CMOS Current Mirror / Divider
Organization: Indiana Univ-Purdue University Indianapolis
This invention relates to current mirror circuits useful especially in analog and mixed-signal integrated circuits and particularly to a current mirror circuit that provides very high precision and a wide range of current divisions, for applications such as high accuracy A/D and D/A converters, reference cells, and high current comparators. Current mirror circuits, common to analog and mixed-signal circuits offer wide bandwidth and have been developed in bipolar, MOS and BiCMOS technologies. Improvements in their designs have been numerous, ...
Digital CMOS Voltage Interface Circuits
Organization: Indiana Univ-Purdue University Indianapolis
This invention relates to digital CMOS voltage interface circuits, particularly, voltage interfaces which transfer the digital signal between any two voltages, with minimal power dissipation. CMOS is the principal technology used today to implement high performance digital as well as analog applications. When scaling a CMOS technology, the supply voltages are decreased to control electric field inside transistors and also to reduce dynamic power dissipation. This however reduces circuit speed. To overcome this drawback different power ...
Model for Simulating Tree Structured VLSI Interconnect
Organization: Indiana Univ-Purdue University Indianapolis
In VLSI and ULSI circuit design where millions of circuit elements are placed on a single chip, a fast and accurate computer simulation of the behavior of the circuit is essential. This invention offers an accurate method of simulating an RLC tree and more particularly it gives a method of evaluating time domain signals within an RLC tree in response to any input signals for VLSI circuits. Since the interconnect delay dominates gate delay in current deep VLSI circuits, an accurate characterization of their behavior and signal transients are ...
Image Sensor with a Current Sensing Active Pixel (CSAP)
Organization: Indiana Univ-Purdue University Indianapolis
This is an improved CMOS image sensor, which is 40 times faster than conventional CMOS image sensors, operating from a 3.3 V power supply, with significantly lower 1/f noise. The circuit utilizes the standard APS design and retains the high fill factor in a 0.35 m standard CMOS process. In this current sensing active pixel (CSAP) sensor, the negative feedback circuit that connects the readout of the pixel increases the current driving capabilities and readout speed. The first advantage of the in-pixel transistor current sampling is the high ...
Wire Pattern Continuity Test System
Organization: Indiana Univ-Purdue University Indianapolis
A Batch Processed Multi-Lead-Transfer Vacuum Packaging for Sensors and Circuits
Organization: University of Michigan
A semiconductor device that uses polysilicon as an electrostatic bonding medium and as a lead transfer for multiple lead connection to one or more electrical devices within a vacuum sealed chamber. A semiconductor region, such as a heavily built P silicon region, is bonded to a glass substrate of the device. The semiconductor region includes a recess that defines a chamber between the semiconductor region and the substrate. Multiple internal electrodes or lead transfers within the chamber pass through separate electrical connection regions ...
Flexible Integrated Circuit Packaging
Organization: George Washington University
